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SK Hynix A-Die DDR5 (Extreme Overclocking Chip)

Specifications

• Feature Specification

• Memory Type DDR5 SDRAM

• Density 16Gb

• Base Speed 6400-7200 MT/s

• Overclock Potential 8000-9000+ MT/s

• Voltage Range 1.1V – 1.55V

Part Numbers

• H5CG48MEBD-X014

• H5CG48AGBD

• H5CGD8AKBD-X021

DRAM Chip Tray Packaging

Tray Type Capacity

• JEDEC Tray 50 chips

• High Capacity Tray 100 chips

• Master Carton 2,000–5,000 chips

SK Hynix M-Die DDR5

Specifications

Feature Specification

• Density 16Gb

• Speed 5600-6400 MT/s

• Overclock Range 7200-7800 MT/s

DRAM Chip Tray Packaging

Tray Type Capacity

• JEDEC Tray 50 chips

• High Capacity Tray 100 chips

• Master Carton 2,000–5,000 chips

Samsung DDR5 B-Die / C-Die

Feature Specification

• Density 16Gb

• Speed 5600-6400 MT/s

• Maximum OC 7600 MT/s

Optimized for low-latency gaming RAM.

DRAM Chip Tray Packaging

Tray Type Capacity

• JEDEC Tray 50 chips

• High Capacity Tray 100 chips

• Master Carton 2,000–5,000 chips

Micron DDR5 Performance IC

Specifications

Feature Specification

• Density 16Gb

• Speed 6400 MT/s

• Application Gaming & workstation RAM

Tray Type Capacity

• JEDEC Tray 50 chips

• High Capacity Tray 100 chips

• Master Carton 2,000–5,000 chips

Tape-and-Reel Packaging

Reel Type Capacity

• Standard Reel 1,000 chips

• OEM Reel 2,500 chips

All shipments include:

• anti-static ESD packaging

• humidity barrier bags

• lot tracking labels

• tamper-proof seals.

Contact us

Whether you want to place an order, you have a request, or a query, use the form below to get in touch with our team.